Home | Contact Us

45nm Migration Case Studies

Analog Mixed Signal IP Modules: European IDM

65nm and 45nm ported DAC reference section65nm and 45nm ported DAC reference section

65nm and 45nm ported DAC reference section

Type of chip/IP:

  • 20 analog mixed signal IP modules including ADCs, DACs, PLLs, bandgaps

 

Business Goals:

  • Achieve early availability of qualified analog mixed signal modules used widely across the corporation in 65nm process node to support various SoC development programs
  • Avoid the need to redesign existing IP or tie up valuable analog design resources
  • Avoid estimated 15-18 month cycle time to redevelop the same IP for 45nm

 

Source Process:

  • Crolles/TSMC compatible 65nm

 

Target Process:

  • TSMC CRN45 45nm

 

Size of die/IP pre migration:

  • Various

 

Size of die/IP post migration:

  • Same

 

Project Cycle time:

  • Complete migration of portfolio in 16 weeks to new PDK in the target process

 

Results:

  • Working first time silicon achieved for all modules with initial characterization meeting specification

 


HDMI IP Core: European IDM

65nm and 45nm ported SerDes65nm and 45nm ported SerDes

65nm and 45nm ported SerDes

Type of chip/IP:

  • HDMI IP module

 

Business Goals:

  • Achieve fast availability of HDMI IP core (TSMC 65nm) in 45nm process node to support other SoC developments
  • Avoid the need to redesign existing IP or tie up valuable analog/RF design resources
  • Avoid estimated 12 month cycle time to redevelop the same IP for 45nm

 

Source Process:

  • Crolles/TSMC CLN065 65nm

 

Target Process:

  • TSMC CLN045LP 45nm

 

Size of die/IP pre migration:

  • Confidential

 

Size of die/IP post migration:

  • Confidential

 

Project Cycle time:

  • Design delivered in new process in 7 calendar weeks

 

Results:

  • Design in mass production for a wide range of products

 


MIPI IP Core: European IDM

65nm and 45nm ported Rx Buffer65nm and 45nm ported Rx Buffer

65nm and 45nm ported Rx Buffer

Type of chip/IP:

  • MIPI D-PHY module

 

Business Goals:

  • Achieve fast availability of MIPI IP core (TSMC 65nm) in 45nm process node to support other SoC developments
  • Avoid the need to redesign existing IP or tie up valuable analog/RF design resources
  • Avoid estimated 12 month cycle time to redevelop the same IP for 45nm

 

Source Process:

  • Crolles/TSMC CLN065 65nm

 

Target Process:

  • TSMC CLN045LP 45nm

 

Project Cycle time:

  • Design delivered in new process in 6 calendar weeks

 

Results:

  • Circuit used in a wide range of products

 


Mobile 3G Platform IP: European IDM

    65nm and 45nm ported 3G DAC65nm and 45nm ported 3G DAC

65nm and 45nm ported 3G DAC

Type of chip/IP:

  • 12 Mobile 3G platform analog mixed signal IP modules

 

Business Goals:

  • Achieve early availability of 3G mobile IP modules (TSMC 65nm) in 45nm process node to accelerate mobile integration platform development in 45nm process technology
  • Achieve aggressive market window to secure design-in wins with strategic customers
  • Free up valuable analog/RF design resources to work on new IP and platform integration challenges by avoiding redesign of existing and proven IP
  • Avoid estimated 18-24 month cycle time to redevelop the same IP for 45nm

 

Source Process:

  • TSMC CLN065LP 65nm

 

Target Process:

  • TSMC CLN045LP 45nm

 

Size of die/IP pre migration:

  • Confidential

 

Size of die/IP post migration:

  • Confidential

 

Project Cycle time:

  • Full design delivered in 14 calendar weeks

 

Results:

  • Product successfully used in a wide range of phone applications

 

Copyright IN2FAB Technology 2014