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90nm Migration Case Studies

Analog Mixed Signal IP Modules: European IDM

Analog Mixed Signal IP Modules - 2003

Type of chip/IP

  • 8 analog mixed signal IP modules including ADCs, DACs, PLLs, bandgaps


Business Goals

  • Achieve early availability of qualified analog mixed signal modules used widely across the corporation in 90nm process node to support various SoC development programs
  • Avoid the need to redesign existing IP or tie up valuable analog design resources
  • Avoid estimated 12 month cycle time to redevelop the same IP for 90nm


Source Process

  • Crolles/TSMC 0.13m


Target Process

  • Crolles/TSMC 90nm


Project Cycle time

  • 12 calendar weeks for porting of layout and schematics to target process/PDK


Results

  • Working first time silicon for all modules
  • Used in SoC designs in production
  • Same modules have subsequently been migrated to 65nm and 45nm process nodes




GSM Frequency Synthesizer Module: US IDM


Type of chip/IP

  • GSM Frequency Synthesizer


Business Goals

  • Enable existing and proven IP to be reused with early availability in 90nm process node
    to support a time sensitive GSM development program
  • Accelerate early availability of GSM IP in 90nm and reduce risk of overall program
  • Meet tight schedule for market release of end product through faster cycle time


Source Process

  • Internal foundry 0.13m


Target Process

  • Crolles/TSMC 90nm


Size of die/IP pre migration

  • 1467.3m x 2385.45m drawn


Size of die/IP post migration

  • 440m x 715m (0.3x linear shrink)


Project Cycle time

  • 4 calendar weeks for porting of layout and schematics to target process/PDK


Results

  • Working first time silicon for entire module
  • Used in GSM application designs in production

 

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